By second generation threelayer structure designincrease water flow coverage areamake water flow more scientificimprove heat dissipation efficiency
#2
Copper plate is integrated with highprecison CNC processingwith highprecision CNC processingwith large water flow coverage areaand the cavity is scientifically rigorous fluid analysiswithout dead angle of water flowthus providing effective heat dissipatio
#3
10MM thick copper plate designmaterial enoughsurface electroplating treatmentAntioxidationcorrosion resistancedue to the use of thick copper platethe sealing ring can be designed with a single layerrelative to the thin copper plate with multiple sealing r
#4
Copper plate adopts large area hollowing out to reduce weightrealize lightweight designreduce cold head weightprotect PCB from deformationThe height of several positioning columns in the grooves is optimized to ensure that they fit the required heat dissi
#5
Please double check the graphics card detail model to ensure compatibility If you are not very sureplease refer to the third picture in the description picture and compare whether the PCB in the picture is the same as that of your graphics cardOr Please f
Validate your login